As a result, each Xi3-based computer contains the bare minimums of processor, memory/storage and I/O. The Xi3 architecture also supports virtually any operating system.

The Xi3 Modular Computer takes this three-board, Xi3 architectural design approach and then houses it within a strong yet lightweight metal cube made from extruded aluminum. At less than 4-inches per side, the Xi3 Modular Computer is small enough for almost any embedded solution, while also being easy to repair and upgrade and aesthetically pleasing. Additionally, the aluminum casing serves itself as a type of heatsink, while the flow-through design of the Modular Computer and the placement of the processor on the Xi3 backplane combine to help mitigate and dissipate heat blooms inside the enclosure itself. Three of the external sides of the aluminum casing also host separate universal mounting slides, making it simple to mount an Xi3 Modular Computer to almost anything, anywhere.

Slated for launch in the Fall of 2010, the Modular Computer is initially designed for select vertical market solutions. It is further designed to be flexible, adaptable, versatile, compact, strong, lightweight, inexpensive to manufacture, and easy to use, repair, upgrade and recycle.

The split motherboard design of the Xi3 architecture will also allow for longer lifecycles as the system can be adapted to new technologies as they are introduced to the market.

In fact, we are confident in saying that with the unveiling of the Xi3 Computer Architecture and the Modular Computer from Xi3 Corporation, we believe we have been successful in
Re-Designing The Computer.